Laser Scribing - INNOLAS • IPVF - L’Institut Photovoltaïque d’Île-de-France

Laser Scribing – INNOLAS

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Maximum Sample Size: 20 cm x 20 cm

Silicon, perovskite, CIGS.

List can be extended upon request.

Manufacturer: InnoLas
Model: P164
Minimum training time to use the machine: In-depth training

Picosecond pulsed laser (UV, Green, IR) necessary for silicon wafer opening pre-metallization. Silicon wafer cutting for dimension customization and modularization (e.g. shingle, half-cell modules).
Modularization – Scribing of perovskite solar cells to create interconnections within the cells (c.f – P1,P2,P3 pattern).
Edge isolation through ablation of perovskite materials
Further uses – any desired opening can be produced for optical characterization

Programming desired pattern through common python code
Insert laser input parameters such as power, number of passes, translation speed
Cell dimension is detected through a camera and aligned accordingly to allow the desired pattern to be produced on the physical cell

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Development of new product or service

Enhance an existing product or service

Evaluation of the potential

Development of new product or service

Enhance an existing product or service

Evaluation of the potential