What is it for?

Deposition of metal by e-beam evaporation:
Metallic contacts, grids
Specifications: deposition at ambient temperature
Excellent purity of the film because of the high vacuum condition
Limitation: direct deposition (difficulties to deposit homogeneous film on rough substrate)

How does it work?

The substrate is placed inside the chamber, where a source metal to be deposited is located. The source material is heated to the point where it starts to boil and evaporate. This process requires a high vacuum (10^-6 to 10^-7 Torr) to allow the molecules to evaporate freely in the chamber, and they subsequently condense on all surfaces.

High film deposition rates

Process deposition duration: depends of the thickness (controlled by QCM)